TC250
散熱膏 Thermal Conductive Paste
本產品具有極優異之傳熱效率，可適用於電氣散熱裝置之加強導熱與散熱之用，傳熱效率較一般低散熱係數矽散熱膏優越數倍。
規格說明
Composition |
Silicone material heavily filled |
|
Color |
顏 色 |
White 白色 |
Product Form |
one component |
|
Density @ 25℃, g/cm3 |
密 度 @ 25℃ g/cm3 |
2.75 |
Viscosity |
Grease like paste |
|
Description |
Non-curing, thermally conductive silicone paste |
|
Potential Uses |
用 途 |
Gap fill material between electronic heat sources and heat sinks |
Features |
特 點 |
Moderate thermal conductivity, low bleed, and high temperature stability |
Application Methods |
使 用 方 法 |
Screen print, stencil print or automated/manual dispensing |
Use Temperature ℃ |
使 用 溫 度 ℃ |
0 ~ 150 |
Thermal Conductivity (Watt/m°K) |
熱 傳 導 率 (Watt/m°K) |
2.0 |
Weight loss % under 200°C/24hrs |
0.37 |
