TC100
Thermal Conductive Paste
Specification
Composition |
Silicone material heavily filled |
Color |
White |
Product Form |
one component |
Density @ 25℃, g/cm3 |
2.65 |
Viscosity |
60,000~100,000cP |
Description |
Non-curing, thermally conductive silicone paste |
Potential Uses |
Gap fill material between electronic heat sources and heat sinks |
Features |
Moderate thermal conductivity, low bleed, and high temperature stability |
Application Methods |
Screen print, stencil print or automated/manual dispensing |
Use Temperature ℃ |
0 ~ 150 |
Thermal Conductivity (Watt/m°K) |
2.0 |
Weight loss % under 200°C/24hrs |
0.37 |