TC100

Thermal Conductive Paste

Specification

Composition

Silicone material heavily filled
with heat-conductive metal oxide

Color

White

Product Form

one component

Density @ 25℃, g/cm3

2.65

Viscosity

60,000~100,000cP
Grease like paste

Description

Non-curing, thermally conductive silicone paste

Potential Uses

Gap fill material between electronic heat sources and heat sinks

Features

Moderate thermal conductivity, low bleed, and high temperature stability

Application Methods

Screen print, stencil print or automated/manual dispensing

Use Temperature ℃

0 ~ 150

Thermal Conductivity (Watt/m°K)

2.0

Weight loss % under 200°C/24hrs

0.37